Titan Loadlocked RIE with VCE
The Titan is a very compact, fully automated, vacuum loadlocked plasma system for semiconductor production. Available in the following configurations: Reactive Ion Etch (RIE); High Density Inductive Coupled Plasma (HDICP) or DRIE. Used for advanced processing of wafers or mounted parts. It also has multiple size batch capability. Small footprint at an affordable price.
System Features
- PLC and touch screen control
- Electrostatic, or mechanical chuck
- Active substrate temperature control
- Vacuum cassette
- Optional laser, and optical endpoints
- Optional high density inductively coupled plasma source (HDICP)
Applications
- Compound Etch, Dielectric Etch, Silicon Trench, MEMS, Quartz Etch, Metal Etch.
