Oracle Production Cluster Tool
The Oracle is the smallest and most flexible full production cluster system on the market. The system consists of a Central Vacuum Transport (CVT), Vacuum Cassette Elevators and up to four Process Reactors. These process reactors are docked to the central loadlock and run in production-mode or can be operated independently. The Oracle can also be configured for either the laboratory environment (with single wafer loading) or for full production (with vacuum cassette elevators).
Because the Oracle accommodates up to four separate process chambers, there are many possible process combinations, including ash, etch, and deposition modules. Processes are safely run without atmospheric contamination since all chambers are vacuum loadlocked.
Films Deposited:
- Oxides
- Oxynitrides
- Nitrides
- Amorphous Silicon
- Silicon Carbide
Process Gases:
- 100% Silane
- <20% Silane
- Ammonia
- TEOS
- Diethylsilane
- Nitrous Oxide
- Oxygen
- Nitrogen
- Trimethylsilane
- Methane
Fluorine Etch Processes (SF6, CF4, CHF3, O2):
- Carbon
- Epoxy
- GaAs/AlGaAs
- Ir
- Mo
- Nb
- OxyNitride
- Polyimide
- Pr (e.g: SiLK or SU8)
- Quartz
- Si
- Sic
- SiO2
- Si3N4
- Ta
- TaN
- TiW
- TiN
- W
Corrosive Chemistry Etch (Cl2, BCl3, SiCl4, HBr, NF3, etc.):
- AlGaAs
- Au
- Carbon
- Cr
- Cu
- GaAs
- GaN
- InAlGaN
- InGaAs
- InGaN
- InP
- LED MQMs
- Pr and other organic materials
- Pt
- Si
- Sic
- Ti
