Minilock ALD

The Minilock ALD system has been designed to provide researchers with the capability to grow Atomic Layer Deposition films through both thermal, and plasma-enhanced modes for substrate sizes up to 300mm. The small footprint and robust design make it ideal for research, and pilot line environments. A biased electrode is standard, which can be used to change the film properties.

By keeping our core components the same, it is very easy to scale to a production cluster platform. Standard processes have been developed for various materials. This is backed by over 25 years’ experience in rapid process development.

System Features:

• PLC and touch screen control
• Inductively coupled plasma source (ICP)
• Biased electrode
• Close coupled precursor delivery (max 8)
• 50°C to 400°C chuck
• 4 Precursor entry points
• 400l/s Maglev turbo
• Vacuum loadlock

Options

Films Deposited

• Microwave source (Compared with ICP, a remote microwave plasma produces a lower content of energetic ions, and the flow of radicals generated can produce much lower damage to the substrate.)
• PECVD processes
• Cluster tool compatible
• 600°C Stainless steel electrode